SIP/DIP Series

SIP/DIP-Series
SIP/DIP Series

Features

  • Molded epoxy body
  • FCC Part 68
Recognized Component Mark

File No.:E75887

RoHS Compliant

Ordering Information

D1A05D –XXXX
ModelContact ArrangementCoil VoltageD:With Diodes Blank:Without the DiodesCustomer code
S1A05D –XXXX
ModelContact ArrangementCoil VoltageD:With Diodes S:Metal CoverCustomer code

Coil Data at 25°C

DIP Specifications

Contact FormPart NumberNominal Voltage
(VDC)		Coil Resistanece
±10%		Must Operate
(VDC)		Must Release
(VDC)		Rated Current
(mA)		Continuous Voltage
(max)		Circuit Schematic
1A
SPST-NO		D1A05(D)55003.751.010101A Circuit Schematic
D1A12(D)1210009.001.21220
D1A24(D)24215018.002.411.128
1B
SPST-NC		D1B05(D)55003.751.01071B Circuit Schematic
D1B12(D)1210009.001.21215
D1B24(D)24215018.002.411.128
2A
DPST-NO		D2A05(D)51403.751.035.7102A Circuit Schematic
D2A12(D)125009.001.22420
D2A24(D)24215018.002.411.128
1C
SPDT-CO		D1C05(D)52003.751.025101C Circuit Schematic
D1C12(D)125009.001.22420
D1C24(D)24215018.002.411.128

SIP Specifications

Contact FormPart NumberNominal Voltage
(VDC)		Coil Resistanece
±10%		Must Operate
(VDC)		Must Release
(VDC)		Rated Current
(mA)		Continuous Voltage
(max)		Circuit Schematic
1A
SPST-NO		S1A05(D)55003.751.01010SIP 1A Circuit Schematic
S1A12(D)1210009.001.21220
S1A24(D)24200018.002.41228

*Form B SIP Available

CHARACTERISTICS

Item \ Contact Form2A,1A,1B1C
Contact Resistance100mΩ max. (Initial)150mΩ max. (Initial)
Operate Time(Max.)0.5ms1.0ms
Bounce Time(Max.)0.5ms2.0ms
Release Time(Max.)0.2ms0.2ms
Insulation Resistance(Min.)1011Ω1011Ω
Contact MaterialPrecious MetalsPrecious Metals
Power(Max.)10VA3VA
Switching Voltage(Max.)200VDC100VDC
Switching Current(Max.)0.5A0.25A
Carry Current(Max.)1.0A0.5A
Life Expectancy108 (Signal level)5×107 (Signal level)
Breakdown VoltageDC250V across open contactDC200V across open contact
DC500V between coil and contactDC500V between coil and contact
Storage Condition-40°C ~ +85°C-40°C ~ +85°C
Operating Condition-40°C ~ +70°C-40°C ~ +70°C
UL Class B/FInsulation System Class B/FInsulation System Class B/F
Minimum Permissible Load100mVDC 10μA100mVDC 10μA
Vibration20g(10 ~ 2000Hz)20g(10 ~ 2000Hz)
Resonant Frequency3.5 KHz3.5 KHz

OUTLINE DIMENSIONS Unit: inch(mm)

DIP Type

DIP Type Outline Dimensions

SIP Type

SIP Type Outline Dimensions

Remark:
1) In case of no tolerance shown in outline dimension: outline dimension ≤1mm,tolerance should be ±0.2mm; outline dimension ＞1mm and ≤5mm,tolerance should be ±0.3mm;outline dimension ＞5mm, tolerance should be ±0.4mm.
2) The tolerance without indicating for PCB layout is always ±0.1mm.

PACKAGING SPECIFICATION

TUBEOUTER CARTONOUTER CARTON SIZE
25PCS5000PCSL540mm*W200mm*H165mm

APPLICATION GUIDELINES

Automatic Wave Soldering
* Wave solder is the optimum method for soldering.
* Adjust the level of solder so that it does not overflow onto the top of the PC board.
* Unless otherwise specified, solder under the following conditions depending on the type of relay.

Preheat time
20°C-100°C		Rising slope
20°C-120°C		Decreasing slope
Peak-150°C		Slodering temperature
255°C-265°C
90±5 seconds＜3°C/s＜4°C/s3~5s

Hand Soldering
* Keep the tip of the soldering iron clean.

Solder lron30W or 60W
lron Tip TemperatureApprox. 350°C 662°F
Solder TimeWithin approx. 3 seconds

* Immediate air cooling is recommended to prevent deterioration of the relay and surrounding parts due to soldering heat.
* Although the sealed type relay can be cleaned, avoid immersing the relay into cold liquid
(such as washing solvent) immediately after soldering. Doing so may deteriorate the sealing performance.

Discard the dropped product

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