Features
- With arc extinguishing magnets
- High performance DC relay for photovoltaic power generation systems, energy storage system and xEV charging device, etc
File No.:E75887
File No.:R 50471143
Contact Ratings
Contact Arrangement | 1A |
---|---|
Contact Resistance | Max.10mΩ (by voltage drop 6VDC 20A) |
Contact Material | SiIver AIIoy(Non-Cd) |
Contact Rating (Resistive) | 15A 500VDC, On 1s/Off 19s, 30,000 ops. |
Max. Switching Voltage | 500VDC |
Max. Switching Current | 15A |
Mechanical Life | 1×106 operations |
Electrical Life | 15A 500VDC, ON 1s/OFF 19s 30,000 ops 20A 300VDC, ON 1s/OFF 19s 30,000 ops |
Characteristics
Insulation Resistance | 1000MΩ (at 500VDC) | |
---|---|---|
Dielectric Strength | Between coil & contacts | 5000VAC 1min |
Between open contacts | 2000VAC 1min | |
Surge Voltage | 10kV(1.2/50μS) | |
Operate time (at nomi. volt.) | ≤30ms | |
Release time (at nomi. volt.) | ≤10ms | |
Humidity | 5%~85% RH | |
Operation temperature | -40°C~+85°C | |
Shock Resistance | Functional | 98m/s2 |
Destructive | 980m/s2 | |
Vibration resistance | 10Hz ~ 55Hz 1.5mm DA | |
Unit weight | Approx. 130g | |
Construction | Sealed Type, Dust Cover Type, Flux Tight Type |
Ordering Information
HAG01M | F | A | S | DC | 12 |
---|---|---|---|---|---|
Model | F:Class F H:Class H | A:SPDM single-pole, double-make | C:Dust Cover Type S:Sealed Type E:Flux Tight Type | Coil:DC | Coil Voltage |
Notes:
1. PC board assembled with dust cover type and flux tight type relays can not be washed and/or coated.
2. Dust cover type and flux tight type relays can not be used in the environment with dust, or H2S, SO2, NO2 or similar gaseous environment etc.
Coil Data at 25°C
Nominal Voltage VDC | Operate Voltage (Max.) VDC | Release Voltage (Min.) VDC | *Max. Allowable Voltage VDC | Coil Resistance Ω±10% |
---|---|---|---|---|
6 | 4.50 | 0.30 | 6.60 | 14.4 |
9 | 6.75 | 0.45 | 9.90 | 32.4 |
12 | 9.00 | 0.60 | 13.20 | 57.6 |
24 | 18.00 | 1.20 | 26.40 | 230.4 |
Note:”*Max Allowable Voltage”: The relay coil can endure max allowable voltage for a short period time only.
Coil
Coil Power | Approx. 2.5W |
---|
Safety Approval Ratings
UL&CUL | 20A 300VDC, ON 0.5s/OFF 9s, 25°C, 3×104 OPS 20A 300VDC, ON 0.5s/OFF 9s, 85°C, 1×104 OPS |
---|---|
TüV | 10A 500VDC, ON 1s/OFF 9s, 25°C, 3×104 OPS 15A 500VDC, ON 1s/OFF 19s, 25°C, 3×104 OPS 20A 300VDC, ON 1s/OFF 19s, 25°C, 3×104 OPS 10A 500VDC, ON 1s/OFF 9s, 85°C, 1×104 OPS 15A 500VDC, ON 1s/OFF 19s, 85°C, 1×104 OPS 20A 300VDC, ON 1s/OFF 19s, 85°C, 1×104 OPS |
NOTES:
1. All values without specified temperature are at 25°C.
2. The above lists the typical loads only. Other loads may be available upon request.
OUTLINE DIMENSIONS, WIRING DIAGRAM AND PC BOARD LAYOUT. Unit: inch(mm)
Outline Dimensions
Wiring Diagram
(Bottom view)
PCB Layout
(Bottom view)
Remark:
1) In case of no tolerance shown in outline dimension: outline dimension ≤1mm,tolerance should be ±0.2mm; outline dimension >1mm and ≤5mm,tolerance should be ±0.3mm;outline dimension >5mm, tolerance should be ±0.4mm.
2) The tolerance without indicating for PCB layout is always ±0.1mm.
PACKAGING SPECIFICATION
BLISTER BOX | OUTER CARTON | OUTER CARTON SIZE |
---|---|---|
9PCS | 54PCS | L455mm*W220mm*H185mm |
APPLICATION GUIDELINES
Automatic Soldering
* Flow solder is the optimum method for soldering.
* Adjust the level of solder so that it does not overflow onto the top of the PC board.
* Unless otherwise specified, solder under the following conditions depending on the type of relay.
Preheat time 20°C-100°C | Rising slope 20°C-120°C | Decreasing slope Peak-150°C | Welding temperature 255°C-265°C |
---|---|---|---|
90±5 seconds | <3°C/s | <4°C/s | 3~5s |
Hand Soldering
* Keep the tip of the soldering iron clean.
Solder lron | 30W or 60W |
---|---|
lron Tip Temperature | Approx. 350°C 662°F |
Solder Time | Within approx. 3 seconds |
* Immediate air cooling is recommended to prevent deterioration of the relay and surrounding parts due to soldering heat.
* Although the sealed type relay can be cleaned, avoid immersing the relay into cold liquid
(such as washing solvent) immediately after soldering. Doing so may deteriorate the sealing performance.
Discard the dropped product